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New Year Greetings from Bynav X8-M1
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Bynav Exhibits at the 13th China Satellite Navigation Conference
On April 26, Bynav showcased its new generation self-developed high-precision positioning GNSS SOC chip, GNSS/INS combined navigation module (P-MODULE), GNSS/INS combined navigation positioning unit (P-BOX), and inertial measurement unit (IMU-BOX) at the 13th CSNC.
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EPSON and Bynav announces the release of an IMU-enhanced GNSS Rugged receiver X1
Recently, Epson (China) Co., Ltd. (EPSON) announced a strategic cooperation with Bynav, a GNSS high-precision positioning core component manufacturer.